Influence of diamond abrasives on material removal of single crystal SiC in mechanical dicing
Mian Li, Dekui Mu, Yueqin Wu, Guoqing Huang, Hui Meng, Xipeng Xu, Han Huang, Han Huang
Topics & Concepts
Wafer dicingMaterials scienceDiamondAbrasiveWaferCrystal (programming language)Composite materialBrittlenessPolishingMetallurgyNanotechnologyProgramming languageComputer scienceAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchTunneling and Rock Mechanics