High thermal conductivity diamond-doped silver paste for power electronics packaging
Peihao Zhao, Xin Li, Yunhui Mei, Guo‐Quan Lu
Topics & Concepts
Materials scienceDiamondThermal conductivitySinteringComposite materialComposite numberDopingElectrical resistivity and conductivityParticle sizeChemical engineeringOptoelectronicsEngineeringElectrical engineeringElectronic Packaging and Soldering TechnologiesThermal properties of materialsAluminum Alloys Composites Properties