Managing 1000 W high-power chips by a High-Capacity and lightweight 3D thermosyphon: An experimental and theoretical study
Shichao Bu, Zhuye Jiang, Jie Li, Xiaoping Yang, Zhen Sun, Yonghai Zhang, Jinjia Wei
Topics & Concepts
ThermosiphonPower (physics)High heatMechanical engineeringEngineeringMaterials scienceNuclear engineeringThermodynamicsPhysicsHeat exchangerComposite materialHeat Transfer and Boiling StudiesElectronic Packaging and Soldering Technologies3D IC and TSV technologies