A rapid-sintering Cu-Cu joints with ultrahigh shear strength and super reliability for power electronics package
Dongfang Dai, Jing Qian, Jincheng Li, Yexiong Huang, Zeping Wang, Jiabing Yu, Xiao Wang, Xianping Chen, Xianping Chen
Topics & Concepts
Materials scienceSinteringThermal shockShear strength (soil)SolderingInterconnectionReliability (semiconductor)CopperComposite materialMetallurgyPower (physics)Computer scienceQuantum mechanicsSoil scienceEnvironmental sciencePhysicsComputer networkSoil waterAluminum Alloys Composites PropertiesElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies