Effect of ultrasound-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-Foam Co/Cu soldered joints: Experiments and first-principles calculations
Jiamin Zhang, Liang Zhang, Yuhao Chen, Hui Wang
Topics & Concepts
Materials scienceComposite materialMicrostructureIntermetallicScanning electron microscopeElectron backscatter diffractionSolderingTransmission electron microscopyUltrasonic sensorGrain sizeBrittlenessShear strength (soil)DislocationFocused ion beamLayer (electronics)Energy-dispersive X-ray spectroscopyCeramicStelliteMetallurgyHigh-resolution transmission electron microscopyBilayerCavitationGrain growthGrain boundaryComposite numberResonant ultrasound spectroscopyElectron microprobeAcoustic microscopyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis