High Thermal Conductivity Semicrystalline Epoxy Resins with Anthraquinone-Based Hardeners

Abstract

Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (∼0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is ∼2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

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