Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy
Yu-An Shen, Yun-Xuan Lin, Fan-Yi Ouyang, Hiroshi Nishikawa, Ming‐Hung Tsai
Topics & Concepts
IntermetallicSolderingMaterials scienceDiffusion barrierAlloyMetallurgyDiffusionFlux (metallurgy)Composite materialLayer (electronics)ThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesHigh Temperature Alloys and Creep