Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
L. Arnaud, C. Karam, N. Bresson, Christophe Dubarry, S. Borel, M. Assous, Gaëlle Mauguen, Frank Fournel, M. Gottardi, Thierry Mourier, S. Chéramy, Florence Servant
Topics & Concepts
Materials scienceWaferThrough-silicon viaInterconnectionThermocompression bondingOptoelectronicsStackingWafer bondingCopper interconnectEutectic bondingAnodic bondingEtching (microfabrication)Electronic engineeringNanotechnologyComposite materialComputer scienceLayer (electronics)DielectricEngineeringPhysicsComputer networkAlloyNuclear magnetic resonanceEutectic system3D IC and TSV technologiesAdvanced Surface Polishing TechniquesElectronic Packaging and Soldering Technologies