Highly uniform microfluidic electroless interconnections for chip stacking applications
H. T. Hung, Zenghui Ma, Po‐Shao Shih, J.H. Huang, Li-Cheng Kao, C.Y. Yang, Vengudusamy Renganathan, Chin-Li Kao, Chin-Li Kao, Y. C. Hung, C. R. Kao, C. R. Kao
Topics & Concepts
InterconnectionThermocompression bondingMaterials scienceElectroplatingMicrofluidicsCopperVoid (composites)Volumetric flow rateMicrochannelNickelPlating (geology)Pressure dropFlow (mathematics)MetallurgyStackingNanotechnologyCopper platingFlip chipComposite materialChemistryLayer (electronics)MechanicsComputer scienceAdhesiveGeologyPhysicsGeophysicsComputer networkOrganic chemistry3D IC and TSV technologiesElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering Technologies