Shape‐Reconfigurable Crack‐Based Strain Sensor with Ultrahigh and Tunable Sensitivity
S.-B. Lee, Youngoh Lee, Cheolhong Park, Yun Goo Ro, Min Sub Kwak, Geonyoung Jeong, Junseo Park, Hyejin Lee, Pan Kyeom Kim, Sung‐il Chung, Hyunhyub Ko
Abstract
Abstract In the field of wearable electronics and human–machine interfaces, there is a growing need for highly sensitive and adaptable sensors capable of detecting a wide range of stimuli with high precision. Traditional sensors often lack the versatility to adjust their sensitivity for different applications. Inspired by the mechanosensory system of spiders, a shape‐reconfigurable crack‐based sensor with ultrahigh and tunable strain sensitivity based on the precise control of nanocrack formation on a shape memory polymer substrate is demonstrated. This design incorporates a line‐patterned substrate composed of a thermoplastic polyurethane (TPU) matrix and thermo‐responsive shape memory polymer, poly(lactic acid) (PLA), to form parallel nanocracks in a thin platinum film. This design achieves an ultrahigh gauge factor of 2.7 × 10 9 at 2% strain, significantly surpassing conventional sensors. The shape memory property of the TPU/PLA substrate enables tunable strain sensitivity according to the desired strain range, eliminating the need for multiple sensors. The sensor demonstrates exceptional capabilities in detecting subtle strains (as low as 0.025%), monitoring biological signals, and sensing acoustic waves (100–20 000 Hz) with a response time of 0.025 ms. This work represents a significant advancement toward strain sensors with both ultrahigh and tunable sensitivity.