Self-Compliance and High Performance Pt/HfOx/Ti RRAM Achieved through Annealing
Lei Wu, Hongxia Liu, Jinfu Lin, Shulong Wang
Abstract
A self-compliance resistive random access memory (RRAM) achieved through thermal annealing of a Pt/HfOx/Ti structure. The electrical characteristic measurements show that the forming voltage of the device annealing at 500 °C decreased, and the switching ratio and uniformity improved. Tests on the device’s cycling endurance and data retention characteristics found that the device had over 1000 erase/write endurance and over 105 s of lifetime (85 °C). The switching mechanisms of the devices before and after annealing were also discussed.
Topics & Concepts
Materials scienceAnnealing (glass)Resistive random-access memoryComposite materialElectrical engineeringEngineeringVoltageAdvanced Memory and Neural ComputingFerroelectric and Negative Capacitance DevicesSemiconductor materials and devices