A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications
Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Ho, Seit Wen Wei, Sharon Lim Pei Siang, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Jason Tsung-Yang Liow, Surya Bhattacharya
Abstract
Due to the increase in the amount of data handled and evolving data center architectures, there is a growing demand to use high-performance optical transceivers within and between the data centers. We propose a new heterogeneous packaging platform for optical transceivers that can handle higher data rates addressing cost, performance, and form-factor requirements. In this paper, the proof of concept is demonstrated by developing a passive optical engine package with a size of 11mmx11mm integrating electronic and photonic chips. To realize this, a fan-out wafer-level packaging method is employed that can provide high-speed electrical interconnects and integrated photonic chip with suspended optical couplers. By employing this platform, discrete chiplets can be optimized independently and integrated into small-form-factor packages that are otherwise not possible with monolithic integration and provide a clear differentiation compared to other approaches currently in the industry.