The role of ammonium citrate and dodecyl pyridinium chloride on chemical mechanical polishing relevant to SiO2 dielectric layer
Xianglong Zhang, Ni Meng, Xianghui Li, Xukun Mei, Luyao Yang, Yangang He
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceAmmonium chloridePolishingWaferChemical engineeringSlurrySurface roughnessChloridePyridiniumShallow trench isolationLayer (electronics)Composite materialNanotechnologyMetallurgyOrganic chemistryChemistryEngineeringTrenchAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization