Stress analysis and optimization of QFN solder joints under bending-torsion coupled conditions based on the SSA
Jisheng Wei, Chunyue Huang, Chao Gao, Gui Wang
Topics & Concepts
Quad Flat No-leads packageTorsion (gastropod)SolderingStructural engineeringMaterials scienceComposite materialEngineeringMechanical engineeringMedicineLayer (electronics)SurgeryAdhesiveElectronic Packaging and Soldering TechnologiesMetal Forming Simulation TechniquesAdvanced Surface Polishing Techniques