Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density
Qingsheng Zhu, Zi-Feng Ding, Xiang-Fu Wei, Jingdong Guo, Xiaojing Wang
Topics & Concepts
ElectroplatingMaterials scienceFlatness (cosmology)Thermal copper pillar bumpMetallurgyCopperSolderingCurrent densityInterposerWaferComposite materialOptoelectronicsFlip chipLayer (electronics)AdhesivePhysicsEtching (microfabrication)Quantum mechanicsCosmologyElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfaces