The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling
Mohamed El Amine Belhadi, Sa’d Hamasha, Ali Alahmer, Rong Zhao, Barton C. Prorok, Soroosh Alavi
Topics & Concepts
Materials scienceTemperature cyclingIntermetallicSolderingMicrostructureScanning electron microscopeCreepMetallurgyComposite materialEnergy-dispersive X-ray spectroscopyThermalAlloyThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties