Enhanced strength, ductility and electrical conductivity of Cu–Te alloys via dynamic recrystallization and precipitation
Zhe Shen, Zhongze Lin, Peijian Shi, Ganpei Tang, Tianxiang Zheng, Chunmei Liu, Yifeng Guo, Yunbo Zhong
Topics & Concepts
Materials scienceAlloyDynamic recrystallizationRecrystallization (geology)Ductility (Earth science)ExtrusionElectrical resistivity and conductivityPrecipitationMetallurgyComposite materialHot workingCreepElectrical engineeringPhysicsPaleontologyBiologyEngineeringMeteorologyMicrostructure and mechanical propertiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties