Topologically optimized manifold microchannel heat sink with extreme cooling performance for high heat flux cooling of electronics
Jianhong Zhou, Mingxiang Lu, Qi Zhao, Qiang Li, Xuemei Chen
Topics & Concepts
MicrochannelPressure dropHeat sinkHeat fluxMaterials scienceElectronics coolingMechanicsVolumetric flow rateInletThermodynamicsHeat transferMechanical engineeringPhysicsNanotechnologyEngineeringHeat Transfer and OptimizationThermal Radiation and Cooling TechnologiesBuilding Energy and Comfort Optimization