Influence of stand-off distance and pressure in copper coatings deposition efficiency and particle velocity
Bárbara Moreno-Murguía, A.G. Mora-García, Horacio Canales-Siller, Astrid L. Giraldo-Betancur, D.G. Espinosa-Arbeláez, J. Muñoz‐Saldaña
Topics & Concepts
Materials scienceDeposition (geology)Transverse planeGas dynamic cold sprayParticle (ecology)Bar (unit)Particle velocitySubstrate (aquarium)Composite materialCopperParticle sizeAtmospheric pressureCoatingParticle depositionAluminiumMetallurgyMechanicsChemistryMeteorologyGeologyOceanographyRange (aeronautics)SedimentStructural engineeringBiologyPaleontologyPhysicsPhysical chemistryEngineeringHigh-Temperature Coating BehaviorsFluid Dynamics and Heat TransferParticle Dynamics in Fluid Flows