Low viscosity and low temperature curing reactive POSS/epoxy hybrid resin with enhanced toughness and comprehensive thermal performance
Ruiyan Han, Xiaoyan Ma, Lifeng Cai, Zongwu Zhang, Yiliang Fang, Jian Wang
Abstract
resin were 313.2 °C, 123.7 °C, and 102.0 °C, showing increases of 13.0 °C, 2.3 °C, and 6.8 °C compared to the pure resin, respectively, which is difficult to achieve for the general thermosetting resin toughening modification method. This research utilized organic-inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.
Topics & Concepts
EpoxyCuring (chemistry)Materials scienceComposite materialToughnessThermalViscosityThermodynamicsPhysicsSilicone and Siloxane ChemistryEpoxy Resin Curing ProcessesThermal and Kinetic Analysis