Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil
Yan Xiao, Wan‐chang Sun, Zhong-bo Bai, Eryong Liu, Liangliang Du, Hui Cai, Liping Wang, Jing-pei Liu, Ya‐peng Jia, Jie Zhang
Topics & Concepts
CopperCopper platingFOIL methodChemistryComposite numberSulfonateChemical engineeringElectrochemistryDielectric spectroscopyGelatinLayer (electronics)Inorganic chemistryMicrostructureMaterials scienceComposite materialSodiumOrganic chemistryElectrodeElectroplatingPhysical chemistryEngineeringElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilityCorrosion Behavior and Inhibition