Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering
B. Jayachandran, B. Prasanth, R. Gopalan, Titas Dasgupta, D. Sivaprahasam
Topics & Concepts
Materials scienceSinteringElectrical resistivity and conductivityAnnealing (glass)Contact resistanceFabricationElectrical contactsThermoelectric effectElectrodeComposite materialSeebeck coefficientMetallurgyThermal conductivityElectrical engineeringChemistryLayer (electronics)PathologyEngineeringMedicineAlternative medicinePhysical chemistryPhysicsThermodynamicsAdvanced Thermoelectric Materials and DevicesThermal Expansion and Ionic ConductivitySemiconductor materials and interfaces