Scheduling Single-Arm Multicluster Tools for Two-Type Wafers With Lower-Bound Cycle Time
QingHua Zhu, GengHong Wang, Naiqi Wu, Yan Qiao, Yan Hou, MengChu Zhou, Side Zhao
Abstract
In today’s semiconductor manufacturing industry, wafer foundries often face the challenge of producing a variety of integrated circuit chip products using a single manufacturing line. To address this, multicluster tools have become a popular choice for processing multiple wafer types simultaneously. Operating such tools involves coordinating the robots in adjacent individual tools to transport multitype wafers through a shared buffer. This study aims to develop a scheduling method for the concurrent fabrication processes of two wafer types, performed by a multicluster tool with wafer residency time constraints. The proposed approach presents a two-backward sequence, based on a backward strategy of a single wafer type, to convert a one-wafer cyclic schedule into a one-wafer-per-type cyclic schedule while revealing its temporal properties. To ensure a smooth operation of a single-arm multicluster tool system and synchronize multiple robots, several necessary and sufficient conditions are derived for the first time. Two efficient algorithms are then proposed to determine the feasibility of a periodic schedule and obtain a schedule that achieves the lower-bound cycle time under a two-backward strategy, maximizing the productivity of such a multicluster tool. Finally, numerical simulations and two practical examples are presented to demonstrate the applications and performance of the proposed approach.