Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol
Sri Krishna Bhogaraju, Omid Mokhtari, Fosca Conti, Gordon Elger
Topics & Concepts
CopperMaterials scienceFormateThermal decompositionNanoparticlePolyethylene glycolChemical engineeringComposite materialMetallurgyShear strength (soil)NanotechnologyOrganic chemistryChemistryCatalysisEnvironmental scienceEngineeringSoil scienceSoil waterElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability