Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs
Hongyu Qiu, Xiaowu Hu, Shuang Li, Yongqiang Wan, Qinglin Li
Topics & Concepts
Materials scienceSolderingBrittlenessIntermetallicComposite materialShear (geology)FractographyMetallurgyIsothermal processShear strength (soil)Brittle fractureFracture (geology)AlloyEnvironmental scienceSoil sciencePhysicsSoil waterThermodynamicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies