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Three-dimensional structural Cu6Sn5/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards

Shuqing Nie, Yu Xin, Qiuyun Wang, Chengjin Liu, Chang Miao, Limin Yu, Wei Xiao

2023International Journal of Minerals Metallurgy and Materials12 citationsDOI

Topics & Concepts

Materials scienceAnodeAlloyIntermetallicCarbon nanotubeElectrodeTinElectrochemistryPrinted circuit boardCurrent densityNanoparticleCurrent collectorMetallurgyThin filmLeaching (pedology)Composite materialNanotechnologyElectrolyteElectrical engineeringPhysicsSoil waterSoil scienceEnvironmental sciencePhysical chemistryQuantum mechanicsChemistryEngineeringAdvancements in Battery MaterialsSupercapacitor Materials and FabricationNanoporous metals and alloys
Three-dimensional structural Cu6Sn5/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards | Litcius