Growth mechanism and thermal behavior of electroless Cu plating on short carbon fibers
Yuan Ma, Lingjun Guo, Lehua Qi, Jia Sun, Jiancheng Wang, Yuchen Cao
Topics & Concepts
CoatingNucleationMaterials scienceElectroless platingPlating (geology)CopperComposite materialNanoparticleIon platingMorphology (biology)Chemical engineeringMetallurgyLayer (electronics)ChemistryNanotechnologyElectroplatingEngineeringGeneticsGeophysicsOrganic chemistryBiologyGeologyAluminum Alloys Composites PropertiesMXene and MAX Phase MaterialsMagnesium Alloys: Properties and Applications