Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer
Baosheng Wu, Honggang Dong, Yueting Ma, Peng Li, Chao Li, Libing Huang
Topics & Concepts
Materials scienceCopperNickel titaniumTitanium alloyNickelMetallurgyAlloyDiffusion bondingTitaniumMechanism (biology)Joint (building)DiffusionTransition metalComposite materialShape-memory alloyThermodynamicsStructural engineeringEpistemologyEngineeringBiochemistryCatalysisPhilosophyChemistryPhysicsAdvanced Welding Techniques AnalysisAluminum Alloys Composites PropertiesElectronic Packaging and Soldering Technologies