Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux
Haozhong Wang, Xiaowu Hu, Xiongxin Jiang, Yulong Li
Topics & Concepts
Materials scienceSolderingMicrostructureComposite materialIntermetallicShear strength (soil)Grain sizeX-ray photoelectron spectroscopyCarbon nanotubeDirect shear testMetallurgyShear (geology)Chemical engineeringAlloySoil scienceSoil waterEngineeringEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties