Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
Anil Kunwar, Yuri Amorim Coutinho, Johan Hektor, Haitao Ma, Nele Moelans
Topics & Concepts
ElectromigrationAnodeMicroelectronicsMaterials scienceIntermetallicPhase (matter)Current densityWork (physics)Electric fieldAnalytical Chemistry (journal)OptoelectronicsThermodynamicsMetallurgyComposite materialChemistryAlloyPhysicsElectrodeQuantum mechanicsPhysical chemistryOrganic chemistryChromatographyElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesSolidification and crystal growth phenomena