Thermosonic direct Cu pillar bonding for 3D die stacking
Ali Roshanghias, Augusto Rodrigues, Sabine Schwarz, Andreas Steiger‐Thirsfeld
Topics & Concepts
Thermocompression bondingWire bondingDie (integrated circuit)Flip chipMaterials scienceThree-dimensional integrated circuitStackingWaferThrough-silicon viaComposite materialCopperIntegrated circuitNanotechnologyMetallurgyChipOptoelectronicsAdhesiveLayer (electronics)ChemistryElectrical engineeringEngineeringOrganic chemistry3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies