Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
Sri Krishna Bhogaraju, Fosca Conti, Hiren R. Kotadia, Simon Keim, Ulrich Tetzlaff, Gordon Elger
Topics & Concepts
SinteringMicroelectronicsMaterials scienceBrassCopperMetallurgyEconomies of agglomerationShear strength (soil)Polyethylene glycolElectronic packagingComposite materialNanotechnologyChemical engineeringSoil waterSoil scienceEngineeringEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties