Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics
Yang Zuo, Sadie Carter‐Searjeant, Mark Green, Liam Mills, S.H. Mannan
Topics & Concepts
SinteringMaterials scienceNanoparticleOxideBrittlenessComposite materialShear strength (soil)Particle (ecology)Shear (geology)InterconnectionMetallurgyNanotechnologyEnvironmental scienceSoil waterGeologySoil scienceOceanographyComputer scienceComputer networkElectronic Packaging and Soldering TechnologiesNanomaterials and Printing TechnologiesCopper Interconnects and Reliability