Ultrahigh strength, thermal stability and high thermal conductivity in hierarchical nanostructured Cu-W alloy
Junsheng Ke, Rui Liu, Z.M. Xie, Linchao Zhang, X.P. Wang, Q.F. Fang, C.S. Liu, Xuebang Wu
Topics & Concepts
Materials scienceAlloyUltimate tensile strengthThermal conductivityThermal stabilityDuctility (Earth science)Composite materialGrain sizeAnnealing (glass)CopperTungstenMetallurgyChemical engineeringCreepEngineeringAluminum Alloys Composites PropertiesHigh-Temperature Coating BehaviorsFusion materials and technologies