High-strength diffusion bonding of oxide-dispersion-strengthened tungsten and CuCrZr alloy through surface nano-activation and Cu plating
Yuanyuan Chen, Yuan Huang, Fei Li, Lu Han, Dongguang Liu, Laima Luo, Zongqing Ma, Yongchang Liu, Zumin Wang
Topics & Concepts
Materials scienceAnnealing (glass)AlloyDiffusion bondingTungstenMetallurgyScanning electron microscopeDiffusion barrierOxideTransmission electron microscopyComposite materialLayer (electronics)NanotechnologyFusion materials and technologiesAdvanced materials and compositesMetal and Thin Film Mechanics