Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization
Li‐Chi Huang, Yan-Ping Zhang, Chih‐Ming Chen, Liang-Yih Hung, Yu-Po Wang
Topics & Concepts
IntermetallicMaterials scienceIndiumSolderingPhase (matter)DiffusionAlloySolid solutionOstwald ripeningMetallurgyAmorphous solidChemical engineeringThermodynamicsCrystallographyNanotechnologyPhysicsOrganic chemistryChemistryEngineeringElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesIntermetallics and Advanced Alloy Properties