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Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Min-Hsun Yu, Jia-Juen Ong, Dinh-Phuc Tran, Wei-Lan Chiu, Wei-You Hsu, Huai-En Lin, Yuan Chen, H.-C. Tseng, Guan-You Shen, Shih-Chi Yang, Chih Chen, Chih Chen

2023Applied Surface Science41 citationsDOI

Topics & Concepts

X-ray photoelectron spectroscopyCopperAnnealing (glass)PlasmaSurface modificationArgonMaterials scienceContact anglePlasma cleaningAnalytical Chemistry (journal)Plasma activationChemistryChemical engineeringComposite materialMetallurgyPhysical chemistryQuantum mechanicsChromatographyEngineeringOrganic chemistryPhysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability
Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification | Litcius