Experimental research on performance degradation of TSV microstructure under thermal cycling, vibration and electrical stress
Zhengwei Fan, Xun Chen, Yashun Wang, Yu Jiang, Shufeng Zhang
Topics & Concepts
Temperature cyclingMicrostructureElectromigrationMaterials scienceReliability (semiconductor)Stress (linguistics)Failure mode and effects analysisService lifeThree-dimensional integrated circuitThrough-silicon viaDegradation (telecommunications)VibrationComposite materialScanning electron microscopeStructural engineeringSiliconThermalElectronic engineeringIntegrated circuitMetallurgyEngineeringOptoelectronicsAcousticsPhysicsPower (physics)PhilosophyMeteorologyQuantum mechanicsLinguistics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies