Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers
John H. Lau
Abstract
In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV) interposers will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV interposer. Also, some recommendations will be provided.
Topics & Concepts
InterposerComputer scienceThrough-silicon viaSystem integrationMaterials scienceSiliconDistributed computingSystems engineeringElectronic engineeringNanotechnologyEngineeringOperating systemOptoelectronicsEtching (microfabrication)Layer (electronics)3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure Analysis