Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging

Haixue Chen, Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

2023Journal of Materials Science Materials in Electronics12 citationsDOI

Topics & Concepts

Materials scienceSinteringNanoindentationMicrostructureComposite materialCreepElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties