Litcius/Paper detail

Electronic module assembly

Jörg Franke, Lihui Wang, Karlheinz Bock, Jürgen Wilde

2021CIRP Annals23 citationsDOI

Topics & Concepts

Reliability (semiconductor)ElectronicsInterconnectionSurface-mount technologyElectronic componentElectronic packagingPower electronicsComputer scienceProcess (computing)EngineeringSystems engineeringManufacturing engineeringElectrical engineeringPrinted circuit boardPower (physics)TelecommunicationsVoltageOperating systemPhysicsQuantum mechanicsAdditive Manufacturing and 3D Printing Technologies3D IC and TSV technologiesModular Robots and Swarm Intelligence
Electronic module assembly | Litcius