Semiconductor Innovations, from Device to System
Y. J. Mii
Abstract
This year marks the 75 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sup> anniversary since the invention of the transistor and the beginning of the semiconductor industry that has had profound impact on the world and society at large. Technology scaling has been the key driving force behind the numerous innovations that usher in the Information Age. As the fast-expanding applications in 5G, artificial intelligence (AI), advanced driver assistance systems (ADAS), augmented reality and virtual reality (AR/VR), and robotics continue to propel the demand for data-centric products and services, future generations of semiconductor technology will require innovations across the entire stack – from material and device to design infrastructure, architecture and system. In this paper, we will share our perspective of the applications trends and technology advancements that have brought us thus far. We will also outline key innovations that could lay the foundation for future logic technologies. We will conclude the paper with a vision to extend scaling beyond existing frontier into the era of system integration using 3D stacking technologies, thus enabling a roadmap of energy-efficient computing to continue into the foreseeable future.