Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane
Xiuting Li, Xiaomeng Zhu, Jie Dong, Xin Zhao, Qinghua Zhang
Topics & Concepts
Materials sciencePolyimideComposite materialDielectricThermal stabilityComposite numberThermosetting polymerPolymerizationDielectric lossPyromellitic dianhydridePolymerChemical engineeringLayer (electronics)EngineeringOptoelectronicsSynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes