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Challenges and progress in packaging materials for power modules with high operation temperature: Review

Shilin Zhao, Yan Tong, Chunbiao Wang, Erxian Yao

2024Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

Materials scienceEngineering physicsSystems engineeringPower (physics)Process engineeringNuclear engineeringNanotechnologyEngineering ethicsThermodynamicsEngineeringPhysicsSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering TechnologiesAdvancements in Battery Materials
Challenges and progress in packaging materials for power modules with high operation temperature: Review | Litcius