State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
John H. Lau
Abstract
Abstract In this study, the recent advances and trends of chip-let design and heterogeneous integration packaging will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, lateral interconnects, and examples of chiplet design and heterogeneous integration packaging. Also, emphasis is placed on the fundamental and examples of hybrid bonding.
Topics & Concepts
Emphasis (telecommunications)Integrated circuit packagingEngineeringWire bondingSolid-stateChipComputer scienceNanotechnologyElectronic engineeringEngineering physicsSystems engineeringMaterials scienceElectrical engineering3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesVLSI and FPGA Design Techniques