Litcius/Paper detail

Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review

Chong Leong Gan, Min Hua Chung, Lu-Fu Lin, Chen Yu Huang, Hem Takiar

2023Journal of Materials Science Materials in Electronics18 citationsDOI

Topics & Concepts

Materials scienceEpoxyThermal management of electronic devices and systemsMolding (decorative)Reliability (semiconductor)Flip chipElectronic packagingComposite materialStress (linguistics)Mechanical engineeringPower (physics)AdhesiveEngineeringPhysicsPhilosophyLayer (electronics)LinguisticsQuantum mechanicsThermal properties of materialsElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review | Litcius