A methodology for predicting processing induced thermal residual stress in thermoplastic composite at the microscale
Nithin K. Parambil, Branndon R. Chen, Joseph M. Deitzel, John W. Gillespie
Topics & Concepts
Materials scienceComposite materialResidual stressThermal expansionMicroscale chemistryComposite numberPolypropyleneMicromechanicsThermoplasticFiberElastic modulusMathematicsMathematics educationMechanical Behavior of CompositesFiber-reinforced polymer compositesPolymer crystallization and properties