Finite element analysis on processing stress of polysilicon cut by diamond multi-wire saw
Dameng Cheng, Yufei Gao, Runtao Liu
Topics & Concepts
Materials scienceWaferStress (linguistics)DiamondSiliconComposite materialCoupling (piping)BrittlenessFinite element methodSlicingResidual stressStress concentrationWire speedWafer dicingMetallurgyStructural engineeringFracture mechanicsMechanical engineeringOptoelectronicsEngineeringLinguisticsPhilosophyAdvanced Surface Polishing TechniquesTunneling and Rock MechanicsDiamond and Carbon-based Materials Research