Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer
Y. S. Lin, Yu-Chuan Hao, Fan-Yi Ouyang
Topics & Concepts
Materials scienceIntermetallicCopperDiffusion barrierMetallurgyDiffusionDissolutionGrain boundaryConcentration gradientLayer (electronics)Composite materialChemical engineeringMicrostructureChemistryAlloyThermodynamicsEngineeringEnvironmental chemistryPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties