Thermal Performance Analysis of Electronic Components on Different Substrate Materials
Anant Sidhappa Kurhade, Tushar Gadekar, Gulab Dattrao Siraskar, Swapna Swapnil Jawalkar, Ramdas Biradar, A.A. Kadam, Rahul Shivaji Yadav, Sagar Arjun Dalvi, Shital Yashwant Waware, Chaitalee Naresh Mali
Abstract
This study numerically analyzed different substrate board materials, including FR4, silicon, and copper, for electronic component cooling. Ten diverse components were mounted on these boards and subjected to uneven heat distribution. Both natural and forced air cooling were tested at various speeds. Copper cladding significantly lowered component temperatures by 34-54 degrees Celsius compared to FR4 or silicon at 7 m/s. Moreover, copper allowed for lower fan speeds (5 m/s) while keeping component temperatures below 100 degrees Celsius, reducing energy consumption. These results offer valuable guidance for thermal engineers in selecting optimal substrate boards for efficient electronic cooling.